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  • 소속캠퍼스한국표준과학연구원
  • 전공 측정과학
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연구분야

광대역 광원을 이용한 반도체 및 디스플레이 소자 정밀구조 계측

Precision dimensional metrology of semiconductor devices and display panels using broadband source

대표연구실적

-  Jungjae Park, Seung-Woo Kim/Vibration-desensitized interferometer by continuous phase shifting with high speed fringe capturing/Optics Letters/2009.12.18 -  Jungjae Park, Lingfeng Chen, Quandou Wang, Ulf Griesmann/Modified Roberts-Langenbeck test for measuring thickness and refractive index variation of silicon wafers/Optics Express/2012.08.27 -  Saerom Maeng, Jungjae Park, Byungsung O, Jonghan Jin/Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser/Optics Express/2012.05.21

논문(최근 5년)

-  Vibration-insensitive measurements of the thickness profile of large glass panels[OPTICS EXPRESS,2015-12-28] -  Absolute distance measurement method without non-measurable range and directional ambiguity based on a spectral-domain interferometer using the optical comb of the femtosecond pulse laser[APPLIED PHYSICS LETTERS,2016-12-16] -  Optical Fiber-based Confocal and Interferometric System for Measuring the Depth and Diameter of Through Silicon Vias[JOURNAL OF LIGHTWAVE TECHNOLOGY,2016-12-01] -  Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical comb[OPTICS EXPRESS,2017-05-22] -  A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices[SCIENTIFIC REPORTS,2018-10-26] -  Physical thickness and group refractive index measurement of individual layers for double-stacked microstructures using spectral-domain interferometry[OPTICS COMMUNICATIONS,2019-01-15] -  Development of a High-Speed Depth Measuring Machine for through Silicon Vias on a 300 mm Silicon Wafer[Journal of the Korean Society for Precision Engineering,2017-05-01] -  A review of thickness measurements of thick transparent layers using optical interferometry[INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING,2019-03-25] -  Simultaneous measurement method of the physical thickness and group refractive index free from a non-measurable range[OPTICS EXPRESS,2019-08-19] -  Development of Spectral-Domain Interferometer Having Dual Reference Paths based on Polarization for Measuring Absolute Distances[Journal of the Korean Society for Precision Engineering,2020-03-01] -  Feasibility Study on Dimensional Standard for Material Extrusion type 3D Printed Structures [Journal of the Korean Society for Precision Engineering,2020-04-01] -  Precise thickness profile measurement insensitive to spatial and temporal temperature gradients on a large glass substrate[APPLIED OPTICS,2020-07-10] -  A novel method for simultaneous measurement of thickness, refractive index, bow, and warp of a large silicon wafer using a spectral-domain interferometer[METROLOGIA,2020-07-30]

특허(최근 5년)

-  공기 부상 박막 두께 측정 장치[2019-10-28] -  광픽셀어레이를 이용한 박막과 후막의 두께 및 삼차원 표면 형상 측정 광학 장치[2019-06-03] -  측정 불가 구간과 방향 모호성이 없는 절대거리 측정을 위한 분광형 간섭계 시스템[2017-10-26] -  대형 유리기판의 물리적 두께 프로파일 및 굴절률 분포 측정을 위한 광간섭계 시스템[2017-04-27] -  원격검출용 주파수 및 강도 변조 레이저 흡수 분광장치 및 방법[2016-07-19] -  광주파수 및 강도 변조 레이저 흡수 분광 장치 및 광주파수 및 강도 변조 레이저 흡수 분광 방법[2016-06-15] -  측정 불가 영역을 극복한 두께 및 굴절률 측정 장치[2020-06-30]