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윤정원 교수

Jeong-Won Yoon

INFO

  • 소속캠퍼스한국생산기술연구원 스쿨
  • 전공 생산기술
    (산업소재ㆍ스마트제조공학)
  • 연락처032-850-0237
  • 출신전공신소재공학(재료물성)
  • 학위박사
  • 최종출신대학성균관대학교 일반대학원
  • 이메일

연구분야

전자 패키징, 솔더링, 마이크로 조이닝, 3D 패키징

Electronic Packaging, Soldering, Micro-joining, 3D Packaging

대표연구실적

-  Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung/Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions/Microelectronics Reliability/54(2) (2014) 410-416 -  Jeong-Won Yoon, Bo-In Noh and Seung-Boo Jung/Comparative study of ENIG and ENEPIG as surface finishes for a Sn-Ag-Cu solder joint/Journal of Electronic Materials/40(9) (2011) 1950-1955 -  Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Hoo-Jeong Lee and Seung-Boo Jung/Microstructural evolution of Sn-rich Au-Sn/Ni flip chip solder joints under high temperature storage testing condition/Scripta Materialia/56(8) (2007) 661-664

논문(최근 5년)

-  Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate[Metals and Materials International,2014-05-01] -  Interfacial reaction and mechanical property between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions[ JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2015-03-01] -  Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints[ JOURNAL OF ALLOYS AND COMPOUNDS,2015-04-01] -  Electromigration effect on Sn-58%Bi solder joints with various substrate metallizations under current stress[ JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2016-02-01] -  Board Level Drop Reliability of Epoxy-Containing Sn-58mass% Bi Solder Joints with Various Surface Finishes[ MATERIALS TRANSACTIONS,2016-03-01] -  Effect of hygrothermal treatment on reliability of thermo-compression bonded FPCB/RPCB contact joints[ MATERIALS TRANSACTIONS,2016-05-01] -  Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications[ SURFACE AND INTERFACE ANALYSIS,2016-07-01] -  Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints[ JOURNAL OF ELECTRONIC MATERIALS,2016-12-01] -  Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications[ MICROELECTRONICS RELIABILITY,2017-04-01] -  Cu-Sn and Ni-Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging[ JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2017-06-01] -  Enhancement of Cu pillar bumps by electroless Ni plating[ MICROELECTRONIC ENGINEERING,2017-08-01] -  Die-Attach for Power Devices using the Ag Sintering Process: Interfacial Microstructure and Mechanical Strength[ METALS AND MATERIALS INTERNATIONAL,2017-09-01] -  전기자동차용 고신뢰성 파워모듈 패키징 기술 [마이크로전자 및 패키징학회지,2014-10-01] -  자동차 전장용 무연솔더 및 솔더 접합부의 신뢰성 평가 [대한용접접합학회지,2016-02-01] -  미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성 [마이크로전자 및 패키징학회지,2017-03-01] -  ENEPIG/Sn-Ag-Cu 솔더 접합부의 취성 파괴에 미치는 무전해 니켈 도금액의 영향 [대한용접접합학회지,2017-06-01] -  Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications[ JOURNAL OF ELECTRONIC MATERIALS,2018-01-01] -  자동차 전력반도체 모듈 적용을 위한 Sb계 무연 솔더의 열화 특성[대한용접접합학회지,2017-10-01] -  0.1㎛ Ni두께를 가지는 thin ENEPIG 층과 SAC305 솔더와의 계면반응 및 접합강도[대한용접접합학회지,2017-12-01]

특허(최근 5년)

-  솔더볼 제조장치 및 방법[2017-03-23] -  반도체칩 접합방법 및 이를 이용하여 접합된 반도체칩[2017-05-04] -  필러범프제조방법 및 이를 이용하여 제조된 필러범프[2017-01-02] -  14. 솔더범프 제조용 지그, 플립칩 접합방법 및 이에 의하여 형성된 플립칩[2017-11-22]

연구과제 수행 실적

EV/HEV 파워 모듈용 250℃ 이하 소자 접합을 위한 고효율/고방열 Cu Sintering 접합 소재 개발 Fine pitch(30㎛이하급) 플립칩 패키지 PCB용 Thin-ENEPIG 표면처리 기술 개발 유럽 환경규제(WEEE) 대응 태양광 발전설비용 접속함 개발