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PARK JUNGJAE(Professor)

INFO

  • AffiliationKorea Research Institute of Standards and Science
  • Majors Science of Measurement
  • Contact Information042-868-5873
  • Major기계공학과
  • DegreePh.D.
  • Highest Level of Education한국과학기술원
  • E-Mail

Field of Research

Precision dimensional metrology of semiconductor devices and display panels using broadband source

Research Results

-  Jungjae Park, Seung-Woo Kim/Vibration-desensitized interferometer by continuous phase shifting with high speed fringe capturing/Optics Letters/2009.12.18 -  Jungjae Park, Lingfeng Chen, Quandou Wang, Ulf Griesmann/Modified Roberts-Langenbeck test for measuring thickness and refractive index variation of silicon wafers/Optics Express/2012.08.27 -  Saerom Maeng, Jungjae Park, Byungsung O, Jonghan Jin/Uncertainty improvement of geometrical thickness and refractive index measurement of a silicon wafer using a femtosecond pulse laser/Optics Express/2012.05.21

Treatise

-  Fizeau-type interferometric probe to measure geometrical thickness of silicon wafers[Optics Express,2014-09-17] -  Vibration-insensitive measurements of the thickness profile of large glass panels[OPTICS EXPRESS,2015-12-28] -  Absolute distance measurement method without non-measurable range and directional ambiguity based on a spectral-domain interferometer using the optical comb of the femtosecond pulse laser[APPLIED PHYSICS LETTERS,2016-12-16] -  Optical Fiber-based Confocal and Interferometric System for Measuring the Depth and Diameter of Through Silicon Vias[JOURNAL OF LIGHTWAVE TECHNOLOGY,2016-12-01] -  Total physical thickness measurement of a multi-layered wafer using a spectral-domain interferometer with an optical comb[OPTICS EXPRESS,2017-05-22] -  A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices[SCIENTIFIC REPORTS,2018-10-26] -  Physical thickness and group refractive index measurement of individual layers for double-stacked microstructures using spectral-domain interferometry[OPTICS COMMUNICATIONS,2019-01-15] -  Development of a High-Speed Depth Measuring Machine for through Silicon Vias on a 300 mm Silicon Wafer[Journal of the Korean Society for Precision Engineering,2017-05-01]

Patent

-  광섬유 페룰 공진기를 이용한 스펙트럼 영역 간섭 장치 및 스펙트럼 영역 간섭 방법[2014-10-08] -  홀 형상 및 깊이 측정 장치 및 방법[2014-06-09] -  렌즈형 광섬유를 이용한 미세홀 깊이 측정 장치 및 방법[2014-04-24] -  FBG를 이용한 스펙트럼 영역 간섭 장치 및 스펙트럼 영역 간섭 방법[2014-10-24] -  대형 유리기판의 물리적 두께 프로파일 및 굴절률 분포 측정을 위한 광간섭계 시스템[2017-04-27] -  원격검출용 주파수 및 강도 변조 레이저 흡수 분광장치 및 방법[2016-07-19] -  광주파수 및 강도 변조 레이저 흡수 분광 장치 및 광주파수 및 강도 변조 레이저 흡수 분광 방법[2016-06-15] -  측정 불가 구간과 방향 모호성이 없는 절대거리 측정을 위한 분광형 간섭계 시스템[2017-10-26]